ISL29028
Typical Circuit
A typical application for the ISL29028 is shown in
Figure 5. The ISL29028’s I 2 C address is internally
hardwired as 0b100010<x>, with x representing the
logic state of input I 2 C address pin ADDR0. The device
can be tied onto a system’s I 2 C bus together with other
I 2 C compliant devices.
Soldering Considerations
Convection heating is recommended for reflow soldering;
direct-infrared heating is not recommended. The plastic
ODFN package does not require a custom reflow
soldering profile, and is qualified to +260°C. A standard
reflow soldering profile with a +260°C maximum is
recommended.
( http://www.intersil.com/data/tb/TB477.pdf )
Suggested PCB Footprint
It is important that users check the “Surface Mount
Assembly Guidelines for Optical Dual FlatPack No Lead
(ODFN) Package” before starting ODFN product board
mounting.
( http://www.intersil.com/data/tb/TB477.pdf )
Layout Considerations
The ISL29028 is relatively insensitive to layout. Like
other I 2 C devices, it is intended to provide excellent
performance even in significantly noisy environments.
There are only a few considerations that will ensure best
performance.
Route the supply and I 2 C traces as far as possible from all
sources of noise. A 0.1μF and 1μF power supply decoupling
capacitors need to be placed close to the device.
V I2C_PULL-UP
R1
10k Ω
R2
10k Ω
R3
10k Ω
I 2 C MASTER
MICROCONTROLLER
V DD
SLAVE_0
V IR-LED
SLAVE_1
I 2 C SLAVE_n
INT
SDA
SCL
1
ADDR0 IRDR
8
SDA
SDA
C1
1μF
C2
0.1μF
2
3
VDD
GND
INT
SDA
7
6
SCL
SCL
4
REXT
SCL
5
REXT
499k Ω
ISL29028
FIGURE 5. ISL29028 TYPICAL CIRCUIT
11
FN6780.2
November 4, 2011
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